ModICE® is a complete line of connector enclosures that offer sealed packaging solutions for rugged electronic control modules. The Cinch 1.5mm SHS system is the base interconnect technology.

The ModICE® Advantage:
• 3 distinct enclosure sizes (ME, SE, LE)
• Multiple header configurations (18, 30, 48 and 60 I/O)

Available Options:
• ME Header with integrated RF Ports (SMA, RP-SMA)
• Headers with integrated ferrite filtering
• Blank headers for specific customer applications
• Enclosures with integrated heat sink (SE and LE)
• Vented enclosures (Breather vent)
• Simple module assembly with snap-in header/PCB