The polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
No rework required, enabling high productivity
Protects surfaces helping reduce replacement parts
Available with both polyethylene and cardboard tape core
RoHS compliant.



Suggested Applications
Use for masking printed circuit boards during wave solder or solder dip processing
Used as release surface in fabrication of parts cured at elevated temperatures.