Embossed, copper foil backing resists discoloration and oxidation
Offers stable contact resistance and good shielding effectiveness
Embossed backing cuts through the layer of adhesive for establishing contact between the backing and the application substrate
Flame-retardant and suitable for grounding and EMI shielding in equipment, components and shielded rooms
Withstands a wide temperature range of -40 to 266 �F (-40 to 130 �C)
Offers outstanding solderability with tin-plated coating
Rated for 600V applications

Suggested Applications