LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE® ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version Thermally conductive : 2.0 W/m-K Reworkable Flexible Specifications: Brand LOCTITE MPN 540920 Unit Of Measure 19 Grams Weight (kg) 0.019